Fluid Distribution Comparison
Industry-Standard PVA Brush
Industry-Standard PVA brushes lose roughly half their water flow through the body of the brush between the nodules. This lost water contributes no positive effect to wafer cleaning, nor to the purging of particles from nodule faces.
Observe the uneven water flow pattern across the length of the standard PVA brush. These irregularities in water distribution can lead to areas with insufficient water, posing a risk of damage to the wafer, reducing cleaning effectiveness, and subsequently reducing yields.
TechCore PVA Brush System
The TechCore PVA brush encases the body of the brush in exchangeable high-purity polymer slide rails. This system leaves only the PVA nodules exposed. Water, therefore, must exit exclusively through the nodules, where it will directly contribute to cleaning the wafer and purging particle contaminants from the nodules.
The TechCore PVA brush achieves remarkably even water distribution along the entire length of the brush. This optimized water flow ensures consistent and effective cleaning of the wafer, with superior purging of nodule contaminates.
DI Water and Cleaning Chemistries Distribution Pattern
This distribution test shows the relative amount of water coming from each section of the brushes. The TechCore PVA brush has optimized water delivery across the length of the brush, resulting in a virtually even distribution. This leads to better cleaning of the wafer and better purging of nodule contaminates.
TecchCore PVA Sample Program
To demonstrate our advanced technologies and help customers validate our PVA Brushes performance, we offer a sample program which provides potential customers with qualification samples of our TechCore PVA Brush System.
